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| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | Digi-Key Data Plans | - | - | - | - | - | - | - | - | - |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | Digi-Key Data Plans | - | - | - | - | - | - | - | - | - |
| | | | 联系我们 | PCB Symbol, Footprint & 3D Model | Digi-Key Data Plans | - | - | - | - | - | - | - | - | - |
| | GSM/2G/3G SIM+PLT MINI 2FF 1PK | | 联系我们 | PCB Symbol, Footprint & 3D Model | NEO | - | - | - | 2FF (Mini) | - | - | - | - | 2G, 3G |
| | TRIPLE 2FF/3FF/4FF CAT-M VER | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 5.842mm Dia x 12.345mm L | - | -65°C ~ 125°C | 2FF (Mini), 3FF (Micro), 4FF (Nano) | - | - | - | - | - |
| | GSM/2G/3G SIM+PLT MICRO 3FF 10PK | | 联系我们 | PCB Symbol, Footprint & 3D Model | NEO | - | - | - | 3FF (Micro) | - | - | - | - | 2G, 3G |
| | GSM/2G/3G SIM+PLT MICRO 3FF 1PK | | 联系我们 | PCB Symbol, Footprint & 3D Model | NEO | - | - | - | 3FF (Micro) | - | - | - | - | 2G, 3G |
| | LTE/3G SIM+PLT INDUST 2FF 5PK | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | - | - | - | - | - | - |
| | LTE/3G SIM+PLT CONSUMER 2FF 10PK | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | - | - | - | - | - | - |
| | LTE/3G SIM+PLT INDUST 2FF 10PK | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | - | - | - | - | - | - |
| | LTE/3G SIM+PLT CONSUMER 3FF 1PK | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | - | - | - | - | - | - |
| | LTE/3G SIM+PLT CONSUMER 3FF 5PK | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | - | - | - | - | - | - |
| | IOT SIM KIT - 5 SIMS & $10 BAL. | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | Includes Data Plan | -25°C ~ 85°C | 2FF (Mini), 3FF (Micro), 4FF (Nano) | - | - | - | - | 2G, 3G, 4G LTE IOT |
| | GOBAL IOT TRI-CUT SIM -2G/3G/4G | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | -25°C ~ 85°C | 2FF (Mini), 3FF (Micro), 4FF (Nano) | - | - | - | - | 2G, 3G, 4G LTE IOT |
| | MICRO-SIM 3FF ATT COMM TEMP | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 33.6mm L x 29mm W x 6.63mm H | - | -25°C ~ 85°C | 3FF (Micro) | - | - | - | AT&T | - |
| | MICRO-SIM 3FF SPRINT COMM TEMP | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 15mm L x 12mm W x 0.86mm H | - | -25°C ~ 85°C | 3FF (Micro) | - | - | - | Sprint | 4G |
| | MICRO-SIM 3FF T-MOBILE COMM TEMP | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 33.6mm L x 29mm W x 6.63mm H | - | -25°C ~ 85°C | 3FF (Micro) | - | - | - | T Mobile | - |
| | MICRO-SIM 2FF 3FF 4FF T-MOB COMM | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 33.6mm L x 29mm W x 6.63mm H | - | -25°C ~ 85°C | 2FF (Mini), 3FF (Micro), 4FF (Nano) | - | - | - | T Mobile | - |
| | MICRO-SIM 3FF VODA COMM TEMP | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | 33.6mm L x 29mm W x 6.63mm H | - | -25°C ~ 85°C | 3FF (Micro) | - | - | - | Vodafone | - |
| | 2FF/3FF/4FF SIM FOR 2G/3G/LTE IO | | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | -25°C ~ 85°C | 2FF (Mini), 3FF (Micro), 4FF (Nano) | A (5V), B (3V), C (1.8V) | ST33G1M2 | 1280Kb Flash, 30Kb RAM | Universal | 2G, 3G, 4G LTE IOT |