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选择 | 图片 | 产品详情 | 单价 | 可用性 | ECAD 模型 | Series | Type | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Wire Gauge | Diameter | Composition | Mesh Type | Melting Point | Flux Type | Process |
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联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | * | - | - | - | - | - | - | - | - | - | - | - | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | ALPHA® | - | - | 6 Months | Date of Manufacture | - | - | - | - | - | - | - | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | ALPHA® | - | - | 6 Months | Date of Manufacture | - | - | - | - | - | - | - | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | Solder Paste | Jar | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | - | - | - | - | No-Clean | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | - | Solder Paste | Jar | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | - | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | No-Clean | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 44 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 14 AWG, 16 SWG | 0.062" (1.57mm) | Sn99 (99) | - | - | Rosin Mildly Activated (RMA) | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 44 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 11 AWG, 13 SWG | 0.093" (2.36mm) | Sn99 (99) | - | 430 ~ 473°F (221 ~ 245°C) | Rosin Activated (RA) | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 44 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 14 AWG, 16 SWG | 0.062" (1.57mm) | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Rosin Activated (RA) | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 275 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 14 AWG, 16 SWG | 0.062" (1.57mm) | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | No-Clean | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | OR421 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 11 AWG, 14 SWG | 0.086" (2.18mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 48 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 14 AWG, 16 SWG | 0.062" (1.57mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 48 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 16 AWG, 18 SWG | 0.050" (1.27mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 275 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 24 AWG, 25 SWG | 0.020" (0.51mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 331 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 14 AWG, 16 SWG | 0.062" (1.57mm) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 44 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 20 AWG, 22 SWG | 0.031" (0.79mm) | Sn95Sb5 (95/5) | - | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 331 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 14 AWG, 16 SWG | 0.062" (1.57mm) | Sn95Ag5 (95/5) | - | 430 ~ 473°F (221 ~ 245°C) | Water Soluble | Lead Free | |||
联系我们 | 联系我们 | PCB Symbol, Footprint & 3D Model | 44 | Wire Solder | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | 20 AWG, 22 SWG | 0.031" (0.79mm) | Sn95Sb5 (95/5) | - | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | Lead Free |
焊料是指专门设计用于将金属表面连接在一起的金属合金。有各种类型的焊料可用于不同的应用场景。包括条状焊料、带状焊料、焊膏、焊丸、焊球和焊线。焊料的直径范围从0.006英寸(0.15毫米)到0.250英寸(6.35毫米),以满足不同的焊接需求。 焊料的熔点因具体合金组成而异。它的熔点范围从244°F(118°C)到1983°F(1084°C)。焊料有无铅和含铅两种选择,以满足环境考虑的需求。 除了不同的焊料类型外,还有各种用于与焊料配合使用的助焊剂。助焊剂有助于去除氧化物和杂质,使焊料能够与金属表面正确结合。助焊剂的类型包括酸芯、无清洁型、松香活性型、松香轻度活性型和水溶性型。每种助焊剂都具有不同的特性,适用于特定的焊接应用。 通过选择适当的焊料类型、直径、熔点和助焊剂类型,技术人员可以确保成功和可靠的金属连接过程。在选择适当的焊料和助焊剂组合时,需要考虑具体的应用要求和环境因素。
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请告知我们您的需求,我们的销售代表将在 1 个工作日内回复您。